Director Operations, Semi Conductor Assembly
Position Description: Performs diverse management function that
encompasses setting goals, assignments and working with an experienced, best in
class engineering group to continue to maintain technical leadership in
established market segments.
often require new design with unique thin wafers and prototypes that are tested
for QA prior to assembly.
include wire bonding, Flip Chip assembly, plastic molding, wafer thinning and
dicing and inspection to remain best in class in the industry for specific
disciplines. The company produces the highest quality dice for ultra thin
wafers for more electronic functionality in smaller packages.
including ISO 9001:2000 and US Government list of space level IC assembly and
company has a culture of quality serving more than 1000 loyal customers.
Duties and Responsibilities:
Director of Operations will understand the semi conductor chip packaging
assembly process and materials and be responsible for managing the
manufacturing operations assembly process that often requires new design
Management of Operations group including:
Planning and setting goals
Assigning specific duties
Estimating and managing project time frames
Effective communications with customers and employee’s
semi conductor operations experience and competence; solid Manufacturing
Management experience, effective communication skills, self motivation;
analytical and planning skills; We are looking for a disciplined leader with
the organizational, leadership and people management skills to achieve our
traditional high quality, productivity and efficiency goals.
a BS in Electrical Engineering or related technical discipline plus a minimum
of ten years of related technical operations management experience including
prior experience in a supervisory/leadership role. Prefer an MD in Electrical Engineering plus a
minimum of seven years in a leadership role.
Compensation range: $125,000 to $150,000 plus performance bonus